- sure fixing of the chip for the reballing - sure and clean reballing with a low cost expenditure - about 50 further models available Place the stencil template that matches precisely the pitch pattern of the BGAs. Spread the solder balls on the solder pads. If all pads have received a solder ball, remove the excess balls. The solder balls can melt only on the solder pads. After the stencil template and the BGA's have been cooled down, the stencil template ca be removed.
Trustpilot
3 days ago
2 months ago
