BGA162(eMCP) Reball Kit_11.5X13mm, eMCP Rework, BGA162 reballing, BGA reballing Kit, eMCP Replace, eMCP reballing Tool 5sets/lot

Description

Specification 1.Steel Dimensions: (80 x 80) mm, apply to BGA162, size: 11.5X13mm2.The unique tin ball storage room design, no need to poure out excess solder ball every time, make production more efficiency. 3.For more other BGA Reballing Kit, please contact us.4.BGA162(eMMC) Reball Kit_11.5X13mm