COOL-GUMPAD CGP7156 is a new class of thermal interface gap-filler material that dispenses like a thermal pad, but performs with characteristics like a grease or gel when device temperatures increase to over 45°C. It has a compressibility of up to 3 times its original thickness to fill in all uneven thermal interface surfaces. COOL-GUMPAD applications include LED luminaire modules, large area power modules, and large area metal-core printed wiring board (MCPWB). COOL-GUMPAD CGP7156 is optimized to accommodate large areas with different heights and gaps. It is filled with a modified boron nitride admixture and is electrically insulating at normal voltage. It is designed to have high compressibility in comparison to traditional thermal pads. Once the device temperature reaches 45°C, COOL-GUMPAD will "melt-flow" to fill even the smallest of trapped air along the interface between the device and heat-sink or heat-spreader.
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