Remove surface mount components connectors, QFDs, PLCCs, SOICs and chip components without costly and professional equipment. Use with your existing rework equipment or temperature controlled soldering irons. Special removal alloy has excellent ability with a low melting temperature of 136°F (58°C). To use: apply paste flux to all leads with syringe; melt liquid alloy on all pins of SMD; with wide iron tip; maintain alloy in a molten state long enough to release chip; lift chip from board with pick-up tool. Safe, affordable, easy and won't damage sensitive components. Removal alloy - 6.5 in" length per alloy.
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