ALLSOCKET BGA153-0.5mm-TP Socket FBGA153 Burn-in Socket Adapter IC Size 11.5x13mm Pitch 0.5mm eMMC153-0.5MM Debug Adapter-BGA153-0.5mm-TP(Non-Soldering Version)

Description

Professional manufacturer in all kinds of IC chip testing sockets and adapters. Note: Verify your IC Dimension(Width)before purchase or Email us([email protected],Skype:Amanda Qin ALLSOCKET)for enquiry. Technical support and datasheet are available if you needed. Socket Type: Test & burn-in socket Socket PN: BGA/eMMC153-0.5TP01NS Features: *High quality and durable *Tested before shipping *Easy to use-by Screw(not Soldering) Supported Devices MCU/Chip/IC in: *Package * BGA153* FBGA153 *Pitch: 0.5 mm *Pin count: 46 pins *IC body: 11.5x13 mm *IC tip-to-tip: 11.5x13 mm Material & Specifics: *Structure: Open-top Version, fix to pcb adapter/testing board via screws(Non-Soldering) *Socket Body: PES, PEI or Equivalent *Contacts: Beryllium Copper Alloy *Contact Plating: Gold over nickel *Contact Force: 18g Per pin (Normal) *Operation Force: Max 1.0kg *Contact Resistance: 30mohm MAX.a1 10mA and 20mV max (Initial) *Insulation Resistance: 1,000m ohm min. at DC 500V *Dielectric withstanding voltage For 1 Minute at AC 700V *Operation Temperature: -40 ~ +150 Celsius degree *Operation Life: 100,000 times +-1%(Mechanical) Package contained: *1 piece BGA153-0.5mm-TP Socket: ALLSOCKET Note: *More sockets & adapters(Customizable): Apply to IC chip, MCU, Crystal, FPC board, SSD, FLASH, DDR, eMMC, eMCP, etc *Sockets and adapters for SOP, SSOP, TSSOP, QFP, QFN, BGA, SOT, MSOP, DFN and customize design *For customize socket or more product detial, please contact us *Our partners: Samsung, Hynix, Foxconn, Toshiba, Infineon, MTK, Intel, Huawei, ZTE, Winbond, etc *If you need any help, pls contact us via email