Flexible Highly Conductive Pure Silver Epoxy Elecrically Conductive Adhesive 1 to 1 Mix Dispense, Electro-Bond 17, 10ml Easy Dispense System

Description

http://conductivex.com/Flexible-Highly-Conductive-Pure-Silver-Epoxy-Elecrically-Conductive-Adhesive-1-to-1-Mix-DispenseElectro-Bond 17 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require flexibility coupled with good electrical and mechanical properties. Electro-Bond 17 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require flexibility coupled with good electrical and mechanical properties. Electro-Bond 17 cures at room temperature and can be used as a flexible ""cold-solder"" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, membrane switches, wave guides, flat cable and high frequency shields.Appearance - Silver Benefits - EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry.Components - 2Compressive - 6500Cure Schedule - 24 hours @ Room Temp2 to 4 hours @ 60CCure Type - Room Temp / Heat CureDielectric - 4Dielectric - 410Filler - Silver Glass - 35Hardness - 63Heat - 170Lap - 850Mix - 100/100Operating - from 50 to +140CParticle Size - 44Reactive - 100Shelf - 1 yearShrinkage - 0.0016Specific - 2.46Substrates - aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit boardTensile - 1240Thermal - 1.52Thermal - 11Thermal - 1.4Typical - EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical.Viscosity - PasteVolu